In ABU DHABI, UAE, Centamil today launched Hayagreeva HEx, its first product in AI thermal management. This copper-matrix cold plate handles insane demands for AI data centre infrastructure. Engineers validated it at 5,000W+ continuous heat removal with a super-low 0.005 °C/W thermal resistance.
Transitioning smoothly from old limits, it targets next-gen AI server silicon that blasts past today's cooling capacity. AI accelerator power dissipation has climbed from 300W per chip three years ago to 1,200W today, racing toward 4,400W+ soon. Production cooling simply hasn't kept pace, but Hayagreeva HEx changes everything.
Built for Tomorrow's Silicon
Centamil packs a massive 4,000+ m²/m³ copper-matrix wetted-surface architecture into Hayagreeva HEx. This delivers the thermal headroom the industry desperately needs. "AI silicon has been growing faster than the cooling sitting on top of it," said Praveen Kumar Gorakavi, Founder & CEO of Centamil. "We built Haygreeva HEx for the silicon that's about to ship."
The team moves fast from validation to delivery. Production samples ship within four to six weeks of an executed LOI. Backed by 14 patent filings, this innovation opens doors for data centre operators and OEMs right now.
